Seoul, February 9, 2009
The Economic Times (Bangalore edition)
South Korea’s Hynix Semiconductor announced Sunday it has developed the world’s highest-density memory chip using the thinnest process technology.
The new Hynix DDR3 DRAM (dynamic random access memory) chip adopts a technology that allows circuits inside to be just 40 nanometres apart — a fifth thinner than at present.
A nanometre is one-billionth of a metre. The thinner the process is, the more cutting-edge the technology is for making the chips, which are widely used in computers and other electronic devices.
The new product is 50% more productive than existing chips as it requires less energy and costs less to produce than existing ones, Hynix said.
Mass production begins in the third quarter of this year, it said.
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