NEC Corp has developed the technology to manufacture advanced LSI chips at 40 percent cheaper than current methods. High-performance LSI is used in such products as mobile phones, where various operations are handled by circuits that are embedded along with their respective memory components in a single chip. Previously, higher performance necessitated larger memory components, leading to cost and performance issues. NEC's new approach is to stack memory and operational components - and to connect multiple operational components to shared memory - cutting chip size by about two-thirds and reducing costs. The company will unveil the accomplishment on Monday at the International Solid State Circuits Conference in San Francisco.
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